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Sr. Technical Program Manager, FOS Connectivity Team
Sr. Technical Program Manager, FOS Connectivity Team-March 2024
Shenzhen
Mar 28, 2025
ABOUT AMAZON
Our mission is to be the world’s most customer-centric company.
10,000+ employees
Technology
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About Sr. Technical Program Manager, FOS Connectivity Team

  Description

  Amazon Lab126 is an inventive research and development company that designs and engineers high-profile consumer electronics. Lab126 began in 2004 as a subsidiary of Amazon.com, Inc., originally creating the best-selling Kindle family of products. Since then, we have produced groundbreaking devices like Fire tablets, Fire TV, Amazon Echo and Amazon Show. The Amazon Devices group delivers delightfully unique Amazon experiences, giving customers instant access to everything, digital or physical.

  Want to help shape how connected devices get to market faster? In this role you will drive connectivity and networking software solutions into our products and lead cross functional initiatives to extend the technologies and tools available.

  The Role:

  As a Technical Program Manager - Connectivity, you will engage with an experienced cross-disciplinary staff to design, manage, and deliver innovative consumer products, technologies, and tools. In this role, you will:

  Work with key stakeholders in product management and executive teams to define strategy and requirements

  Lead cross functional development on new technology from design through delivery

  Work with remote teams to deliver supporting software and services in sync with launch timelines and communicate regularly with senior management on status, risks and change control

  Work with subject matter experts to lead and drive new technology initiatives and evaluations for next generation Amazon products and features

  Work with component leads to drive evaluation and adoption of new vendor technologies and HW

  Work with vendors and external partners to deliver device software and firmware technologies into our products

  Develop and champion processes for efficiency and scale in the Connectivity engineering organization

  We are open to hiring candidates to work out of one of the following locations:

  Beijing, 11, CHN | Shenzhen, 44, CHN

  Basic Qualifications

  5+ years of technical product or program management experience

  7+ years of working directly with engineering teams experience

  3+ years of software development experience

  5+ years of technical program management working directly with software engineering teams experience

  Experience managing programs across cross functional teams, building processes and coordinating release schedules

  Experience on connectivity back ground like Bluetooth and Wi-Fi.

  Experience on consumer device development and ODM/CM management

  Preferred Qualifications

  5+ years of project management disciplines including scope, schedule, budget, quality, along with risk and critical path management experience

  Experience managing projects across cross functional teams, building sustainable processes and coordinating release schedules

  Experience defining KPI's/SLA's used to drive multi-million dollar businesses and reporting to senior leadership

  Master’s or advanced technical degree

  Experience defining projects, collecting requirements, writing detailed functional and test specifications, coordinating efforts to scope, schedule and deploy new feature sets

  Experience in technical program/project management in consumer electronics and for SDK extensibility to developers and 3rd parties

  Experience in hardware/software product development

  Experience analyzing cost/benefit of feature selection

  Demonstrable experience in project management and coordinating/driving release schedules, including cross-functional dependency management

  Creative leader with superior analytical abilities

  Knowledge of connectivity technologies such as Wi-Fi, Bluetooth, BLE or ZigBee, and wireless coexistence (CoEx)

  Knowledge of networking and protocol technologies such as HTTP, MQTT

  Experience in RF characterization and integrity

  Knowledge of hardware development process and lifecycle

  Excellent technical, problem-solving and communication skills both written and verbal

  Cross-team coordination and executive presentation skills supported by written documentation

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