At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.

　　Position Description:

　　The candidate will focus on Chip, IC Packaging, Board space and 3D-IC application development. The candidate will work with customers to deeply understand their requirements, and discuss these with the factory to develop the required software.

　　Position Requirements:

　　o Programming skills: C/C++, or Java

　　o Other skills: Tcl, shell script, or Verilog

　　o Strong background in one of the following:

　　- Placement, Routing, Design Flow or Design Optimization

　　- Computational Geometry

　　- EDA Database

　　- System Engineering

　　- Application architecture for Artificial Intelligence

　　o Knowledgeable in UNIX and Windows

　　o Knowledgeable in Electronic Device Nomenclature

　　o Ability to work individually or with a small distributed team

　　o Ability to interact professionally with the customer

　　o Ability to profile the values, requirements, issues, and risks.

　　o Ability to communicate in English

　　We're doing work that matters. Help us solve what others can't.