Microsoft’s Custom Intellectual Property (IP) organization is seeking a driven and innovative Principal Custom Memory Architect to develop our exciting and expanding roadmap. We are responsible for working with our System on a Chip (SoC) partners to develop cutting-edge custom Static Random Access Memory (SRAM) and Register File designs that provide differentiation in power, performance, and area. The team is involved in developing custom memories across a broad range of market segments, including compute, artificial intelligence, and mixed-reality.
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate, high-energy engineers to help achieve that mission.
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
In alignment with our Microsoft values, we are committed to cultivating an inclusive work environment for all employees to positively impact our culture every day.
Responsibilities
As a Principal Custom Memory Architect in the Custom IP organization, you’ll be responsible for defining custom memory solutions which provide differentiating value to SoC products. You’ll be responsible for researching state-of-the-art memory technologies, close collaboration with SoC architects, and pathfinding custom memory solutions to impact SoCs. You’ll be expected to weigh technical tradeoffs affecting performance, power, area, reliability, and yield and to effectively communicate value propositions and risks to organizational leaders. You’ll have opportunity to work with a highly-efficient memory design team, leveraging their expertise into pathfinding new IP solutions across a broad range of market applications.
Demostrated ability to work independently, have keen attention to detail, and be able to provide crisp status of program progress, issues, and risks to the management team. You may also have to travel occasionally.
Embody our Culture (https://careers.microsoft.com/v2/global/en/culture) & Values (https://www.microsoft.com/en-us/about/corporate-values)
Qualifications
Required Qualifications
9+ years of related technical engineering experience
OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience
OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
8+ years of circuit design experience
4+ years of experience with tapeout and post-silicon characterization of custom SRAM or Register File designs
Other Requirements
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Preferred Qualifications
Demonstrated expertise in SRAM and Register File design in advanced process technologies
Understanding of SRAM write and read assist techniques
Deep understanding of industry trends in process and system-level technology
Expertise in yield and reliability
Experience in providing technical guidance to other engineers and multitasking across multiple SoC programs
Ability to concisely communicate design value propositions and risks
Central Processing Unit (CPU) or Artificial Intelligence architectural knowledge
Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $133,600 - $256,800 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $173,200 - $282,200 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
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Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .