Job Description

　　You will be a member of the growing Oregon Wafer Level Assembly (OWLA) organization at RA4 on the Ronler Acres campus. Oregon Wafer Level Assembly is an integral part of Intel's new FOVEROS technology.

　　As a Process Engineer, you will be responsible for all aspects of your assigned module including safety, quality, output, cost of operation, and labor productivity. The scope of work and responsibilities are very similar to those of a fab module engineer.

　　Responsibilities include, but are not limited to:

　　Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.Designing, executing and analyzing experiments necessary to meet engineering specifications.Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.Defining roadmaps to meet requirements, goals and milestones for a new technology process.

　　The ideal candidate should exhibit the following behavioral traits:

　　Written and verbal communication skills.Influence others and build consensus and trust within a team.Making technical decisions and providing technical direction.Learning new processes and tools.

　　Qualifications

　　You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

　　The candidate must possess at least one of the following minimum requirements:

　　Master's degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, Material Science, or equivalent STEM field (candidate must possess the degree or expect to complete the required degree by employment start date) and 3+ months in semiconductor or assembly experience; ORBachelor's degree in Physics, Chemistry, Electrical, Chemical or Mechanical Engineering, Material Science, or equivalent STEM field (candidate must possess the degree or expect to complete the required degree by employment start date) and 1+ years in a semiconductor environment or assembly experience.

　　Inside this Business Group

　　As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

　　Working Model

　　This role will require an on-site presence.