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Oregon Disaggregation Manufacturing (ODM) Die Pick and Place Module Process Engineer
Oregon Disaggregation Manufacturing (ODM) Die Pick and Place Module Process Engineer-March 2024
Hillsboro
Mar 17, 2025
ABOUT INTEL
Intel creates world-changing technology that enriches the lives of every person on earth.
10,000+ employees
Technology
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About Oregon Disaggregation Manufacturing (ODM) Die Pick and Place Module Process Engineer

  Job Description

  You will be a member of the Oregon Disaggregation Manufacturing (ODM) organization working across the Ronler Acers campus and the Aloha campus. ODM processes internal and external products from the wafer level to the die level, then uses advanced Wafer Level Assembly for continued die level processing. ODM includes various process tools and this open position is specifically looking to fill an open position in the Die Pick and Placed module. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts tests and measurements of their operations to ensure control over critical dimensions and defectivity of the process line. Recommends and implements modifications for operating the equipment in order to improve production efficiencies, manufacturing techniques and optimizing production output for existing products, to meet safety, quality and cost indicator goals. Grows insitu manufacturing capacity to high volumes to demonstrate the technology capability while simultaneously transferring the technology to counterparts in manufacturing sites across the globe. Owns execution of maintenance and repair activities for equipment and relevant module of components. Initiates and owns the continuous improvement of equipment and process for key performance indicators (e.g., safety, quality, cost, productivity, defects, and yield) and works with equipment suppliers as required. Owns process development line items aligned to high volume process nodes. Participates in the transfer of technology to other sites through training and audit of installation and qualification outcomes to ensure matched processing across sites. Owns development and optimization of excursion prevention systems for the equipment and process. Owns detection of discrepant material or activities of the equipment and process. During factory ramps, owns equipment install/conversion and qualification to ensure tools are installed safely and on schedule, while meeting all quality/matching criteria (from design through Safety Level 1 and Safety Level Supplier milestones, Intel qual and manufacturing readiness processes).

  Qualifications

  You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and/or internship experience.

  Minimum Qualifications:

  The candidate must possess at least one of the following degrees plus the years of experience determined for each degree in the areas specified below:

  Master's degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science.

  Bachelor's degree in Physics, Chemistry, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or Material Science and 1+ years in a semiconductor environment or assembly experience.

  Inside this Business Group

  As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

  Posting Statement

  All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

  Benefits

  We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

  Working Model

  This role will require an on-site presence.

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