Job Description
Who We Are:
We are a global leader, creating world-changing technology that enables progress and enriches lives. Intel is at the intersection of several technology inflections - artificial intelligence, 5G network transformation, and the rise of the intelligent edge- that together will shape the future of technology.
In DAIS (DAIS Customer Solutions Engineering), GPUs are being applied to help solve today’s most complex and challenging problems through technologies such as AI, media and media analytics, and 3D rendering. Across technology segments, such as high-performance computing (HPC) and visual cloud computing, these new use cases require a different type of computational horsepower to fuel their advanced capabilities. Bringing the GPU into the data center environment helps meet rising requirements for elevated computational demands and always-growing mountains of data.
Description
The Hardware Engineer plays a crucial role in innovating creative solutions to challenging problems within GPU boards, systems, supercomputers, and other technical computing systems. Specifically, you will be required to perform predictive package, board and system level structural analyses and validation testing to ensure the structural integrity of critical components within the system as a key member of the design team. In addition, the hardware engineer will play a design role and contribute to part and assembly design of large, complex liquid cooled systems.
As a Hardware Engineer, your role will perform the following:
Negotiate requirements with customers, stakeholders, and other team members.
Perform and interpret structural analyses and come up with DOEs and run empirical tests.
Develop validation tests and execute root cause investigations.
Create concept, intermediate, and final designs with intermediate milestone peer review and empirical prototype evaluation.
Develop and document tolerance analyses of designs.
Create and communicate drawings and other design collateral through BOM management.
Collaborate with and visit suppliers.
Perform quality inspection of parts (form, fit, function, FAI, and process capability).
Develop solutions the world has yet to see.
The ideal candidate will have the following skills in addition to the qualifications listed below.
Strong mechanical CAD skills using Pro/Engineer, Solid Works or similar.
Willingness to perform first order structural analysis with proficiency in structural modeling techniques using tools such as Abaqus or Ansys Mechanical.
Experience in non-linear, assembly-level structural analysis would be preferred.
Willingness to perform complex tolerance analysis on parts and assemblies.
Willingness to develop and perform empirical testing with knowledge of DOE and technical problem-solving techniques.
Excellent written and oral communication skills for effective intra-team communications, external presentation and negotiations, and overseas communications with suppliers and/or customers.
Innovative and entrepreneurial attitude with a history of bold accomplishments and a reputation for high quality work and attention to detail.
Experience and willingness to apply manufacturing knowledge to design (DFM) in sheet metal, die casting, extrusion, stamping, forging, and plastic injection molding.
Qualifications
Minimum Qualifications:
You must possess the minimum education requirements noted below and minimum required qualifications to be initially considered for this position. Additional preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Masters of Science degree with 2+ years’ experience in Mechanical Engineering.
2+ years of experience devising technical design strategy, coordinating, and integrating design, analysis, and testing from concept through production.
2+ years of experience using Abaqus, Ansys Mechanical or similar structural modeling tools.
Preferred Qualifications:
Experience with mechanical product design of electronic packages, cooling solutions, and/or electronic systems.
Familiarity with circuit board design and interface requirements with ability to use ECAD tools and create keep-out zones and mechanical board models.
Familiarity with heat sink, cold plate and system design process and strong working knowledge of statics and dynamics.
Experience working with database management tools such as Windchill and similar systems (part number creation, BOM creation and management, and revision control).
Inside this Business Group
The focus of Accelerated Computing Systems and Graphics (AXG) is to accelerate our execution in strategic growth areas of high-performance computing and graphics. AXG is chartered with delivering high performance computing and graphics solutions (IP, Software, Systems), for both integrated and discrete segments across client, enterprise and data center. Our mission is to make zeta-scale computing accessible to every human on the planet by the end of this decade and to entertain, educate and connect billions of people with buttery smooth visual experiences.
Other Locations
US, TX, Austin; US, CA, Santa Clara
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)
Annual Salary Range for jobs which could be performed in US, California: $92,847.00-$148,355.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.