Job Description

　　Candidate will be performing lab experiments and characterizations on Cu and solder interconnects in advanced electronic packaging; Metallography sample preparation for SEM/EBSD examinations; Work with Physical Failure Analysis teams on electronic packaging interconnect failure mechanisms.

　　Roles and Responsibilities:

　　Possess good problem-solving skills, ability to work in a dynamic and multi-functional team and the willingness to learn key concepts of microelectronic technology development.Experiment with various approaches involving complex datasets, create proof of concepts and prototypes of new ideas and support strategic enhancements to existing models.Work with Engineers from diverse engineering backgrounds to help understand interconnect failure mechanisms.Present and report on related technical topics.Excellent communication skills to both technical and non-technical audiences, including higher management, internal and external customers.

　　Qualifications

　　You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

　　Minimum Qualifications:

　　The candidate must be pursuing a PhD degree in material sciences or related areas.Demonstrated Hands-on experiences with EBSD, SEM/EDS and metallography sample preparation.

　　Preferred Qualifications:

　　Research experiences on interconnects of advance electronic packaging.

　　Inside this Business Group

　　As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth.

　　Other Locations

　　US, PA, Allentown; US, MA, Lancaster; US, PA, Philadelphia; US, WI, Eau Claire; US, CA, Los Angeles; US, CA, San Francisco; US, CT, Stamford; US, IL, Champaign; US, UT, Lehi

　　Posting Statement

　　All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

　　Benefits

　　We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

　　Annual Salary Range for jobs which could be performed in US, California: $63,000.00-$166,000.00

　　*Salary range dependent on a number of factors including location and experience

　　Working Model

　　This role will require an on-site presence.