Our vision is to transform how the world uses information to enrich life for all .

　　Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

　　Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

　　For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.

　　Our team vision is a continuing desire to develop your skills working in an inclusive diverse environment of multicultural Teams across worldwide geographies! Enabling the creative career path you deserve with a collaborative environment, and groundbreaking technology while rapidly growing your abilities.

　　In HBM DEG (High Bandwidth Memory, DRAM Engineering Group), we innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the field of ML (Machine Learning) and AI (Artificial Intelligence). The success of a sophisticated product such as HBM relies vastly on vertical integration and the various engineering working in unison. To provide greater detail, our HBM technology pertains to stacking numbers of DRAM chips along with a logic chip within one package through an assembly technology called TSV (Through Silicon Via). This greatly increases the memory density in a package, while allowing very high-speed signal transmission. Furthermore, "high bandwidth"; is an outstanding memory design area where custom gate-level design and RTL style logic design are blended into the same product, and most of the DDR or LPDDR design is based on the gate-level design only. Lastly, verification and testing (validation) of HBM is the most ambitious due to the total size of the design and complexity of the functions, and in addition to craft, many innovations are needed for verification and validation of the HBM product, thereby making it uniquely exciting.

　　(Disclaimer): While you may not exhibit all the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity.

　　Our Opportunity Summary

　　In our hybrid role , you will be leading a team HBM Design Architects working on the design & development of next-generation HBM DRAM products. You will be part of a highly multi-functional team of technical subject matter experts collaborating closely with a global team of Design Engineering, Product Engineering, Process Development, Package Engineering & Business Units to execute to a common goal of ensuring our future HBM roadmap is successful. You will apply your deep understanding of memory array architectures, high-speed interface design, logic & custom circuit design, memory subsystem operation, high-performance computing architectures and 2.5D & 3D package integration to understand and analyze bottlenecks and propose innovative architectures to target best in class performance, power, cost, reliability, and quality for Micron’s HBM product portfolio.

　　What’s Encouraged Daily

　　Focused, self-motivated semiconductor foundry interface engineer providing strategic and technical leadership across the semiconductor industry involving wafer foundries and fabless design house.

　　Drive STCO/DTCO power-performance-area-cost (PPAC) modeling and simulation to help qualify the best foundry Technology.

　　Good understanding of advanced CMOS device architecture (FinFET and GAA) and process-design Kits (PDK)

　　Define Reliability specifications to meet the product needs by understanding the customer needs and through closely collaborating with internal product/process development teams.

　　A multi-functional teammate with hands on skills for SPICE and layout tools.

　　Understanding the advanced packaging Technology

　　Specialized in yield and reliability analysis, process flow and integration development, product design and testing optimization to accelerate advanced CMOS technology qualification and mass production ramp-up.

　　Collaborating with integration, module & 3D packaging team (internal and external) to form a clear understanding of the process flow to understand any technology gaps and produce innovative ideas to close the gaps and meet the future needs.

　　Build relationships with suppliers, key stakeholders, senior executives, and multi-functional teams to drive multiple product ramp-up and performance boost projects in fast-paced work environment to meet ambitious timeline.

　　Proven in-depth technical problem-solving and decision-making skills with broad knowledge in electrical / physical (eFA/pFA) and statistical failure analysis to identify root cause, develop and implement corrective and preventive actions in a timely manner.

　　Proficient in statistical computation and modeling skills and sound programming capabilities in Python, JMP and in-house systems.

　　Engage with Customers to support issues with current HBM architectures and find opportunities to innovate on future HBM solutions.

　　Pathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analysis.

　　How To Qualify

　　BSEE or greater

　　10+ years of relevant Engineering or Design Engineering experience

　　Strong process technology development experience and understanding of both IDM, as well as Foundry operating models.

　　Familiarity with DRAM operation and JEDEC specifications, preferably with HBM product family

　　Extensive experience with CMOS circuit design and good understanding of semiconductor device physics

　　Knowledge and experience in digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations

　　In depth technical expertise in one or more areas - DRAM memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics, 2.5D and 3D packaging technologies

　　Good verbal and written communication skills with the ability to effectively synthesize and convey complex technical concepts to other partners and leadership.

　　Strong background of innovation and problem-solving in high-performance memory development.

　　What Sets You Apart

　　Advanced packaging technology/process flow and bottlenecks

　　Memory subsystem operation in high-performance computing applications

　　RTL Design flow, in DRAM process or Foundry process

　　DRAM product bring-up and debug.

　　Package technologies (TSV, hybrid bonding, interposers, etc.)

　　The US base salary range that Micron Technology estimates it could pay for this full-time position is:

　　$184,000.00 - $323,000.00

　　Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job-related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits, discretionary bonuses and equity.

　　As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

　　Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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　　To learn more about Micron, please visit micron.com/careers

　　US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [email protected] or 1-800-336-8918 (select option #3)

　　Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

　　Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.